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[CALL FOR PAPERS] Special Issues on “CAD Technologies” and “Materials”

June 12, 2020

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CALL FOR PAPERS

Journal of Microelectronic Manufacturing

Special Issues

 

•  Special Issue on CAD Technologies (link here)

   Guest Editor: Shiuh-Wuu Lee

   Topic: Computer simulation technologies critical to the development and optimization IC technologies for manufacturing and product design.

   Scope:

      •  TCAD(Technology Computer Aided Design)

      •  Computation Lithography

      •  DTCO(Design Technology Co-optimization )

      •  Material Modeling

      •  CAD for Manufacturing & Testing

   Submission Deadline: September 30th, 2020

•  Special Issue on Materials (link here)

   Guest Editor: Mark Neisser

   Topic: Materials that boost advanced IC manufacturing

   Scope: 

      •  Photoresist Materials

      •  Self-assembling Materials

      •  Antireflection Coatings

      •  Packaging Materials

      •  Other Materials Related to Advanced Semiconductor Processing​

   Submission Deadline: October 30th, 2020