Authors: Tianchun Ye
Institution：Institute of Microelectronics of Chinese Academy of Science
doi：10.33079/jomm.18010101
Authors: Yu-Hao Tsai, Du Zhang, Mingmei Wang
Institution：TEL Technology Center
Keywords：3D-NAND；oxide；nitride；oxynitride；plasma etch；first-principle
doi：10.33079/jomm.18010102
Abstract：
Conducting all-in-one etch process for 3D-NAND fabrication requires close etch rate (E/R) for SiO2 and Si3N4; however, to attain comparable and high etch rate for b...
Authors: Yansong Liu, Chao Zhao, Lisong Dong et al.
Institution：Key Laboratory of Microelectronic Devices, &, Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences
Keywords：micro-sieves；high volume manufacturing；defect free；high yield
doi：10.33079/jomm.18010103
Abstract：
Micro-sieves have been widely used in medical treatment, quarantine, environment, agriculture, pharmacy and food processing. However, the manufacturing and yield improvement have been difficult due...
Authors: Xiaoting Li, Rui Chen, Lei Qu et al.
Institution：North China University of Technology
Keywords：plasma etching；etching model；simulation
doi：10.33079/jomm.18010104
Abstract：
This paper summarizes the status of the plasma etch process modeling research. It mainly introduces typical etching models employing the analytical method, geometric method, system identification m...
Authors: Lithotechsolutions.org
doi：10.33079/jomm.18010105
Abstract：
China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momen...
